? semiconductor components industries, llc, 2011 october, 2011 ? rev. 2 1 publication order number: nta4001n/d nta4001n, nva4001n small signal mosfet 20 v, 238 ma, single, n ? channel, gate esd protection, sc ? 75 features ? low gate charge for fast switching ? small 1.6 x 1.6 mm footprint ? esd protected gate ? aec ? q101 qualified and ppap capable ? nva4001n ? these devices are pb ? free and are rohs compliant applications ? power management load switch ? level shift ? portable applications such as cell phones, media players, digital cameras, pda?s, video games, hand held computers, etc. maximum ratings (t j = 25 c unless otherwise stated) parameter symbol value unit drain ? to ? source voltage v dss 20 v gate ? to ? source voltage v gs 10 v continuous drain current (note 1) steady state = 25 c i d 238 ma power dissipation (note 1) steady state = 25 c p d 300 mw pulsed drain current t p 10 s i dm 714 ma operating junction and storage temperature t j , t stg ? 55 to 150 c continuous source current (body diode) i sd 238 ma lead temperature for soldering purposes (1/8? from case for 10 s) t l 260 c stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above the recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may affect device reliability. thermal resistance ratings parameter symbol max unit junction ? to ? ambient ? steady state (note 1) r ja 416 c/w 1. surface ? mounted on fr4 board using 1 in sq. pad size (cu area = 1.127 in sq. [1 oz] including traces). 2.2 @ 2.5 v http://onsemi.com r ds(on) typ @ v gs i d max (note 1) v (br)dss 1.5 @ 4.5 v 20 v 238 ma (top view) sc ? 75 / sot ? 416 case 463 style 5 2 1 sc ? 75 (3 ? leads) drain gate 3 1 2 source 3 1 3 2 n ? channel marking diagram tf = specific device code m = date code = pb ? free package (note: microdot may be in either location) tf m 1 3 2 pin connections see detailed ordering and shipping information in the package dimensions section on p age 4 of this data sheet. ordering information
nta4001n, nva4001n http://onsemi.com 2 electrical characteristics (t j = 25 c unless otherwise specified) parameter symbol test condition min typ max unit off characteristics drain ? to ? source breakdown voltage v (br)dss v gs = 0 v, i d = 100 a 20 v zero gate voltage drain current i dss v gs = 0 v, v ds = 20 v 1.0 a gate ? to ? source leakage current i gss v ds = 0 v, v gs = 10 v 100 a on characteristics (note 2) gate threshold voltage v gs(th) v ds = 3 v, i d = 100 a 0.5 1.0 1.5 v drain ? to ? source on resistance r ds(on) v gs = 4.5 v, i d = 10 ma 1.5 3.0 v gs = 2.5 v, i d = 10 ma 2.2 3.5 forward transconductance g fs v ds = 3 v, i d = 10 ma 80 ms capacitances input capacitance c iss v ds = 5 v, f = 1 mhz, v gs = 0 v 11.5 20 pf output capacitance c oss 10 15 reverse transfer capacitance c rss 3.5 6.0 switching characteristics (note 3) turn ? on delay time t d(on) v gs = 4.5 v, v ds = 5 v, i d = 10 ma, r g = 10 13 ns rise time t r 15 ns turn ? off delay time t d(off) 98 fall time t f 60 drain ? source diode characteristics forward diode voltage v sd v gs = 0 v, i s = 10 ma 0.66 0.8 v 2. pulse test: pulse width 300 s, duty cycle 2%. 3. switching characteristics are independent of operating junction temperatures.
nta4001n, nva4001n http://onsemi.com 3 typical performance curves 0 0.02 0.04 0.06 0.08 0.1 0.12 0.14 0.16 0.18 0.2 0 0.4 0.8 1.2 1.6 2 vds, drain ? to ? source voltage (v) i d , drain current (a) figure 1. on ? region characteristics v gs = 10 v v gs = 5 v v gs = 2.8 v v gs = 2 v v gs = 2.4 v v gs = 1.4 v v gs = 1.2 v . t j = 25 c 0 0.04 0.08 0.12 0.16 0.2 0.6 0.8 1 1.2 1.4 1.6 1.8 2 v gs , gate ? to ? source voltage (v) i d , drain current (a) figure 2. transfer characteristics t j = 25 c t j = ? 55 c t j = 125 c vds = 5 v 0.5 1 1.5 2 2.5 0 0.05 0.1 0.15 0.2 rds (on) , drain ? to ? source resistance ( ) i d , drain current (a) figure 3. on ? resistance versus drain current and temperature v gs = 4.5 v t j = 125 c t j = 25 c t j = ? 55 c 0.5 1 1.5 2 2.5 0 0.05 0.1 0.15 0.2 rds (on) , drain ? to ? source resistance ( ) i d , drain current (a) figure 4. on ? resistance versus drain current and gate voltage v gs = 2.5 v v gs = 4.5 v t j = 25 c 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 ? 50 ? 25 0 25 50 75 100 125 150 rds (on) , drain ? to ? source resistance (normalized) t j , junction temperature ( c) figure 5. on ? resistance variation with temperature i d = 0.01 a v gs = 4.5 v 0 5 10 15 20 1 10 100 1000 i dss , leakage (na) v ds , drain ? to ? source voltage (v) figure 6. drain ? to ? source leakage current versus voltage t j = 125 c t j = 150 c v gs = 0 v
nta4001n, nva4001n http://onsemi.com 4 typical performance curves 0 5 10 15 20 25 10 5 0 5 10 15 20 gate ? to ? source or drain ? to ? source voltage (v) figure 7. capacitance variation c, capacitance (pf) t j = 25 c ciss coss crss ciss crss vds v gs vds = 0 v v gs = 0 v 1 10 100 1000 1 10 100 r g , gate resistance ( ) figure 8. resistive switching time variation versus gate resistance t, time (ns) v dd = 5 v i d = 10 ma v gs = 4.5 v t d(off) t f t r t d(on) 0 0.02 0.04 0.06 0.08 0.1 0.5 0.55 0.6 0.65 0.7 0.75 0.8 v sd , source ? to ? drain voltage (v) figure 9. diode forward voltage versus current i s , source current (a) t j = 25 c v gs = 0 v ordering information order number package shipping ? nta4001nt1g sc ? 75 (pb ? free) 3000 / tape & reel nva4001nt1g sc ? 75 (pb ? free) 3000 / tape & reel ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d.
nta4001n, nva4001n http://onsemi.com 5 package dimensions sc ? 75 / sot ? 416 case 463 ? 01 issue f style 5: pin 1. gate 2. source 3. drain notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: millimeter. m 0.20 (0.008) d ? e ? ? d ? b e 3 pl 0.20 (0.008) e c l a a1 3 2 1 h e dim min nom max millimeters a 0.70 0.80 0.90 a1 0.00 0.05 0.10 b c 0.10 0.15 0.25 d 1.55 1.60 1.65 e e 1.00 bsc 0.027 0.031 0.035 0.000 0.002 0.004 0.004 0.006 0.010 0.059 0.063 0.067 0.04 bsc min nom max inches 0.15 0.20 0.30 0.006 0.008 0.012 h e l 0.10 0.15 0.20 1.50 1.60 1.70 0.004 0.006 0.008 0.061 0.063 0.065 0.70 0.80 0.90 0.027 0.031 0.035 soldering footprint* *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. 0.787 0.031 0.508 0.020 1.000 0.039 mm inches scale 10:1 0.356 0.014 1.803 0.071 on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 nta4001n/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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